Article -> Article Details
Title | Chip Scale Package LED Market Key Developments, Company Overview |
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Category | Business --> Business and Society |
Meta Keywords | Chip Scale Package LED Market |
Owner | globalresearch |
Description | |
Chip Scale Package LED Market Key
Developments, Company Overview, Competitive Landscape, Demand and Trends by
Forecast to 2030 Chip Scale Package LED Market Overview Market Research Future (MRFR), in its
recently published research report, emphasizes that the global chip-scale
package LED market is booming and expected
to grow exponentially over the review period, recording a substantial market
valuation from USD 743.8 million in 2018 to USD 1.8 billion by 2023, and a
healthy 19.4% CAGR in the forecast period. Get free sample report @ https://www.marketresearchfuture.com/sample_request/7299
Chip Scale Package LED Market Regional
Analysis The geographical analysis of the global
market has been conducted in four major regions, including the Asia Pacific,
North America, Europe, and the rest of the world (Latin America, the Middle
East, and Africa). The Asia Pacific is projected to dominate
the chip-scale package LED market over the review period. Asia Pacific region
is considered as the most potential region in terms of expansion and
implementation of chip scale package LEDs in the areas of smartphone and
display systems. The region has massive potential for income generation in the
chip-scale package LED market, mainly from the consumer electronics industry
verticals. China is anticipated to be the leading country in the Chip scale
package LED market in the Asia Pacific region over the review period. North America is projected to grow at the fastest
rate over the review period. The region has the incidence of many advanced
semiconductor companies that support boosting the growth of chip-scale LED
products in the region. The US is the leading country in the North America
region in terms of market share and this trend is projected to continue in the
foreseeable future. Browse complete report @ https://www.marketresearchfuture.com/reports/chip-scale-package-led-market-7299
Chip Scale Package LED Market Segmental
Analysis The global chip-scale package LED Market
is analyzed into application, and power range. On the basis of application, the market is
segmented into the backlighting unit (BLU), automotive lighting, general
lighting, flash lighting, and others. In the applications segment, the
backlighting unit (BLU) is projected to dominate the market in terms of market
value over the review period due to its growing demand in electronic products,
such as monitor, TV, and other display systems. On the basis of power range, the market is
bifurcated into high power and low- and mid-power. The European market for the chip-scale
package LED market is anticipated to witness substantial growth over the review
period, driven by the established IT and telecom sector in developed economies
such as the UK, Germany, France, and the Netherlands. The market is likely to
reach a stage of maturity over the review period, with steady growth in market
value. Drivers
and Restraints The main driving factors for the chip
scale package LED markets are low production cost and high package density. The
chip-scale package LED market is driven by influential factors such as low-cost
potential owing to the inadvertence of numerous packaging steps, small form
factor with wide beam angle, and high package density and low thermal
resistance and uniform current spreading boosts the market growth. The
product is anticipated to witness a huge adoption in the automotive sector. The
applications in general lighting are another huge opportunity for the chip
scale package LED market to grow at a substantial rate in the upcoming years.
On the other hand, the overload on LED foundries and restraint to premium
products has a negative impact on the growth of this market in the present
market scenario. Low application rate of the chip-scale package LEDs act as a
major limiting factor for the market. Moreover, its restricted
applications in the global electronics sector act as a major limiting factor
for the market over the forecast period. Competitive Analysis The major market players operating in the
global chip-scale packaging market as identified by MRFR are Samsung
Electronics Co., Ltd. (South Korea), Lumileds Holding B.V. (US), OSRAM Opto
Semiconductors GmbH (Germany), LG Innotek (South Korea), Semiconductor Co.,
Ltd. (South Korea), Epistar Corp. (Taiwan), Cree, Inc. (US), Semileds
Corporation (Taiwan), Genesis Photonics Inc. (Taiwan), and Lextar Electronics
Corporation (Taiwan).
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Table Of Contents 1 Executive Summary 2 Market Introduction 2.1 Definition 2.2 Scope Of The Study 2.3 List Of Assumptions 2.4 Market Structure 3 Market Insights 4 Research Methodology 4.1 Research Process 4.2 Primary Research 4.3 Secondary Research 4.4 Market Size Estimation 4.5 Forecast Model
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